Topic - Development

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
Favorable working point and process improvement		Metal	ICP	TCP®	LAM	Development
Product mix issue depending on chamber dedication	Stack	Polysilicon / a-Si	ICP		LAM	Development
B-field real time supervision			MERIE		AMAT	Development
Magnetic field and process stability			MERIE		AMAT	Development
Uniformity and Process transfer	CVD	Polysilicon / a-Si	PE-CVD	AKT	AMAT	Development