Topic - FDC

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
Instable chamber pressure		Oxide	MERIE		AMAT	FDC
E-chuck fault	Trench	Crystal Si	MERIE	HART	AMAT	FDC
Particle in a CVD process	CVD	Oxide	HDP-CVD	Ultima	AMAT	FDC
Parasitic plasma in He feedthrough	VIA etch	Oxide	MERIE	MxP+	AMAT	FDC
Arcing at e-chuck			MERIE			FDC
Instable process - different levels in collision rate	Hard Mask Open	Oxide Nitride Sandwich	Dual Frequency	SCCM Oxide	TEL	FDC
Baratron fault	Gate etch		ICP	TCP®	LAM	FDC
Analysis of DT Etch Plasma Problems using a SEERS Plasma Sensor	Trench	Crystal Si	ICP	DPS	AMAT	FDC