Material - Nitride / Oxinitride

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
Influence of shadow ring material		Nitride / Oxinitride	MERIE	MxP	AMAT	Clean / Conditioning
CD drift due to chamber heating		Nitride / Oxinitride	Dual Frequency	SCCM Oxide	TEL	Process Performance
Increased first wafer effect after PM from chamber heating	Stack	Nitride / Oxinitride	Dual Frequency	SCCM Oxide	TEL	Maintenance
Etch rate dependence on plasma parameters	VIA etch	Nitride / Oxinitride	MERIE	MxP+	AMAT	Process Performance