Material - Nitride / Oxinitride

Title Processes Material Chamber Principle Chamber Hardware Supplier Topic  
Etch rate dependence on plasma parametersVIA etchNitride / OxinitrideMERIEMxP+AMATProcess Performance
CD drift due to chamber heating Nitride / OxinitrideDual FrequencySCCM OxideTELProcess Performance
Influence of shadow ring material Nitride / OxinitrideMERIEMxPAMATClean / Conditioning
Increased first wafer effect after PM from chamber heatingStackNitride / OxinitrideDual FrequencySCCM OxideTELMaintenance