Chamber Principle - ICP

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
Process out of spec by corroded gas ring	Trench	Crystal Si	ICP	TCP®	LAM	Clean / Conditioning
Favorable working point and process improvement		Metal	ICP	TCP®	LAM	Development
Conditioning optimization after wet clean		Oxide	ICP	TCP®	LAM	Productivity
Instable etch rate in lower pressure range	Stack	Polysilicon / a-Si	ICP	TCP®	LAM	Process Performance
Poly and nitride etch in one chamber - process stability and particle generation			ICP	TCP®	LAM	Process Stability
MFC fault detection		Metal	ICP	TCP®	LAM	Process Stability
Product mix issue depending on chamber dedication	Stack	Polysilicon / a-Si	ICP		LAM	Development
Resist mask causes process fault	Stack		ICP	2300	LAM	Process Stability
Instable process caused by RF beat of source and bias power			ICP	TCP®	LAM	Process Stability
Process stability and critical pressure range	Trench		ICP	TCP®	LAM	Process Performance
Baratron fault	Gate etch		ICP	TCP®	LAM	FDC
Process control by wafer-to-wafer-difference			ICP	TCP®	LAM	Process Stability
Open area influences the process	Gate etch	Polysilicon / a-Si	ICP	TCP®	LAM	Process Stability
Dry clean and process stability improvement			ICP	DPS	AMAT	Clean / Conditioning
Removal of toxic residues before open the chamber ready?			ICP	TCP®	LAM	Clean / Conditioning
Remaining oxide after gate etch correlates with collision rate	Gate etch	Oxide	ICP	TCP®	LAM	Process Performance
First wafer effect and prediction of etch profile variations	Gate etch	Oxide	ICP	TCP®	LAM	Clean / Conditioning
Chamber matching at Sputter Clean Chamber	Sputter etch	Oxide	ICP	CSE / HSE	SPTS	Chamber Matching
E-H-Mode transition and its detection in SF6 plasma	Trench	Crystal Si	ICP	DPS	AMAT	Process Stability
Chamber Matching of ICP Etch Chambers using RF Equipment Model	STI		ICP	DPS	AMAT	Chamber Matching
Maintenance and Optimization of Aviza HSE Sputter Etch Chmaber	Sputter etch	Metal	ICP	CSE / HSE	SPTS	Process Stability
Investigation of STI-Etch Process with Hercules Sensor	STI	Resist	ICP	2300	LAM	Clean / Conditioning
Process Stability in Photo Mask Manufacturing	Metal Etch	Metal	ICP	DPS	AMAT	Process Stability
Analysis of DT Etch Plasma Problems using a SEERS Plasma Sensor	Trench	Crystal Si	ICP	DPS	AMAT	FDC
ICC Development and Characterization			ICP	DPS	AMAT	Clean / Conditioning
Implementation of a robust virtual metrology for plasma etching	Gate etch	Oxide	ICP	DPS	AMAT	Virtual Metrology
FDC and WAC enhancement using plasma parameters	CVD	Oxide	ICP	Excelan	LAM	Clean / Conditioning