Processes - VIA etch

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
First wafer effect through idle time	VIA etch		Dual Frequency	IEM	TEL	Process Stability
Parasitic plasma in He feedthrough	VIA etch	Oxide	MERIE	MxP+	AMAT	FDC
Open area shifts plasma parameters	VIA etch	Oxide	MERIE	MxP+	AMAT	Process Performance
Etch rate dependence on plasma parameters	VIA etch	Nitride / Oxinitride	MERIE	MxP+	AMAT	Process Performance
Insensitive etch rate on test wafers	VIA etch		MERIE	MxP+	AMAT	Process Performance