Processes - VIA etch

Title Processes Material Chamber Principle Chamber Hardware Supplier Topic  
Etch rate dependence on plasma parametersVIA etchNitride / OxinitrideMERIEMxP+AMATProcess Performance
First wafer effect through idle timeVIA etch Dual FrequencyIEMTELProcess Stability
Parasitic plasma in He feedthroughVIA etchOxideMERIEMxP+AMATFDC
Open area shifts plasma parametersVIA etchOxideMERIEMxP+AMATProcess Performance
Insensitive etch rate on test wafersVIA etch MERIEMxP+AMATProcess Performance