Title |
Processes |
Material |
Chamber Principle |
Chamber Hardware |
Supplier |
Topic |
|
Control of wet clean cycle by plasma parameters of dry clean | | Polysilicon / a-Si | RIE | | | Clean / Conditioning |  |
Instable etch rate in lower pressure range | Stack | Polysilicon / a-Si | ICP | TCP® | LAM | Process Performance |  |
Product mix issue depending on chamber dedication | Stack | Polysilicon / a-Si | ICP | | LAM | Development |  |
Open area influences the process | Gate etch | Polysilicon / a-Si | ICP | TCP® | LAM | Process Stability |  |
Quality Management in large Area PECVD | CVD | Polysilicon / a-Si | PE-CVD | AKT | AMAT | Process Performance |  |
Uniformity and Process transfer | CVD | Polysilicon / a-Si | PE-CVD | AKT | AMAT | Development |  |
PECVD Process Monitoring In Thin Film Silicon Solar Cell Manufacturing | CVD | Polysilicon / a-Si | PE-CVD | AKT | AMAT | Process Stability |  |