Material - Oxide

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
Instable chamber pressure		Oxide	MERIE		AMAT	FDC
Endpoint verification		Oxide	MERIE	MxP+	AMAT	Process Performance
Particle in a CVD process	CVD	Oxide	HDP-CVD	Ultima	AMAT	FDC
Yield loss detection		Oxide				Productivity
Conditioning optimization after wet clean		Oxide	ICP	TCP®	LAM	Productivity
Parasitic plasma in He feedthrough	VIA etch	Oxide	MERIE	MxP+	AMAT	FDC
Open area shifts plasma parameters	VIA etch	Oxide	MERIE	MxP+	AMAT	Process Performance
Optimization of wet clean cycle		Oxide	MERIE	MxP+	AMAT	Productivity
Stabilization of PECVD process by dry clean	CVD	Oxide	HDP-CVD	Speed	Novellus	Process Stability
Gas composition and process results		Oxide	MERIE	MxP+	AMAT	Process Performance
Remaining oxide after gate etch correlates with collision rate	Gate etch	Oxide	ICP	TCP®	LAM	Process Performance
First wafer effect and prediction of etch profile variations	Gate etch	Oxide	ICP	TCP®	LAM	Clean / Conditioning
Tool and chamber long term matching		Oxide	RIE	MxP+	AMAT	Chamber Matching
Chamber matching at Sputter Clean Chamber	Sputter etch	Oxide	ICP	CSE / HSE	SPTS	Chamber Matching
Process Stability Improvement on a Dual Frequency Etch Tool by Means of Plasma Parameters		Oxide	Dual Frequency	Excelan	LAM	Process Stability
Arcing detection and root cause analysis in low pressure PECVD	CVD	Oxide	PE-CVD	Speed	LAM	Arcing/Breakdown
Implementation of a robust virtual metrology for plasma etching	Gate etch	Oxide	ICP	DPS	AMAT	Virtual Metrology
FDC and WAC enhancement using plasma parameters	CVD	Oxide	ICP	Excelan	LAM	Clean / Conditioning