Chamber Principle - Dual Frequency

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
First wafer effect through idle time	VIA etch		Dual Frequency	IEM	TEL	Process Stability
Implementation of in-situ Measurement Techniques for Plasma Processing	Trench		Dual Frequency	HART	AMAT	Process Stability
Conditioning optimization	Hard Mask Open	Oxide Nitride Sandwich	Dual Frequency	SCCM Oxide	TEL	Clean / Conditioning
Arcing indicated by collision rate	Hard Mask Open	Oxide Nitride Sandwich	Dual Frequency	SCCM Oxide	TEL	Maintenance
Instable process - different levels in collision rate	Hard Mask Open	Oxide Nitride Sandwich	Dual Frequency	SCCM Oxide	TEL	FDC
CD drift due to chamber heating		Nitride / Oxinitride	Dual Frequency	SCCM Oxide	TEL	Process Performance
Increased first wafer effect after PM from chamber heating	Stack	Nitride / Oxinitride	Dual Frequency	SCCM Oxide	TEL	Maintenance
Process Stability Improvement on a Dual Frequency Etch Tool by Means of Plasma Parameters		Oxide	Dual Frequency	Excelan	LAM	Process Stability