ImpressumData Privacy
CompanyContact us
Events| Title | Processes | Material | Chamber Principle | Chamber Hardware | Supplier | Topic | |
|---|---|---|---|---|---|---|---|
| Arcing in gas distribution | MERIE | MxP | AMAT | Maintenance |  | ||
| Magnetic field failure | MERIE | MxP | AMAT | Maintenance | | ||
| Etch rate depends on matchbox | MERIE | MxP+ | AMAT | Maintenance | | ||
| Arcing indicated by collision rate | Hard Mask Open | Oxide Nitride Sandwich | Dual Frequency | SCCM Oxide | TEL | Maintenance | |
| Increased first wafer effect after PM from chamber heating | Stack | Nitride / Oxinitride | Dual Frequency | SCCM Oxide | TEL | Maintenance | |