Chamber Hardware - MxP+

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
Endpoint verification		Oxide	MERIE	MxP+	AMAT	Process Performance
Parasitic plasma in He feedthrough	VIA etch	Oxide	MERIE	MxP+	AMAT	FDC
Open area shifts plasma parameters	VIA etch	Oxide	MERIE	MxP+	AMAT	Process Performance
Etch rate depends on matchbox			MERIE	MxP+	AMAT	Maintenance
Optimization of wet clean cycle		Oxide	MERIE	MxP+	AMAT	Productivity
Gas composition and process results		Oxide	MERIE	MxP+	AMAT	Process Performance
Etch rate dependence on plasma parameters	VIA etch	Nitride / Oxinitride	MERIE	MxP+	AMAT	Process Performance
Contact angle (slope of side wall) depending on plasma parameters			MERIE	MxP+	AMAT	Process Performance
Insensitive etch rate on test wafers	VIA etch		MERIE	MxP+	AMAT	Process Performance
Tool and chamber long term matching		Oxide	RIE	MxP+	AMAT	Chamber Matching