Chamber Hardware - MxP+

Title Processes Material Chamber Principle Chamber Hardware Supplier Topic  
Gas composition and process results OxideMERIEMxP+AMATProcess Performance
Etch rate dependence on plasma parametersVIA etchNitride / OxinitrideMERIEMxP+AMATProcess Performance
Contact angle (slope of side wall) depending on plasma parameters  MERIEMxP+AMATProcess Performance
Endpoint verification OxideMERIEMxP+AMATProcess Performance
Parasitic plasma in He feedthroughVIA etchOxideMERIEMxP+AMATFDC
Open area shifts plasma parametersVIA etchOxideMERIEMxP+AMATProcess Performance
Etch rate depends on matchbox  MERIEMxP+AMATMaintenance
Optimization of wet clean cycle OxideMERIEMxP+AMATProductivity
Insensitive etch rate on test wafersVIA etch MERIEMxP+AMATProcess Performance
Tool and chamber long term matching OxideRIEMxP+AMATChamber Matching