Topic - Process Stability

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
First wafer effect through idle time	VIA etch		Dual Frequency	IEM	TEL	Process Stability
Implementation of in-situ Measurement Techniques for Plasma Processing	Trench		Dual Frequency	HART	AMAT	Process Stability
Poly and nitride etch in one chamber - process stability and particle generation			ICP	TCP®	LAM	Process Stability
MFC fault detection		Metal	ICP	TCP®	LAM	Process Stability
Stabilization of PECVD process by dry clean	CVD	Oxide	HDP-CVD	Speed	Novellus	Process Stability
Resist mask causes process fault	Stack		ICP	2300	LAM	Process Stability
Instable process caused by RF beat of source and bias power			ICP	TCP®	LAM	Process Stability
Process control by wafer-to-wafer-difference			ICP	TCP®	LAM	Process Stability
Open area influences the process	Gate etch	Polysilicon / a-Si	ICP	TCP®	LAM	Process Stability
E-H-Mode transition and its detection in SF6 plasma	Trench	Crystal Si	ICP	DPS	AMAT	Process Stability
Process Stability Improvement on a Dual Frequency Etch Tool by Means of Plasma Parameters		Oxide	Dual Frequency	Excelan	LAM	Process Stability
PECVD Process Monitoring In Thin Film Silicon Solar Cell Manufacturing	CVD	Polysilicon / a-Si	PE-CVD	AKT	AMAT	Process Stability
Maintenance and Optimization of Aviza HSE Sputter Etch Chmaber	Sputter etch	Metal	ICP	CSE / HSE	SPTS	Process Stability
Process Stability in Photo Mask Manufacturing	Metal Etch	Metal	ICP	DPS	AMAT	Process Stability