• APPLICATION DATABASE
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    Supplier - TEL

    Title Processes Material Chamber Principle Chamber Hardware Supplier Topic  
    First wafer effect through idle timeVIA etch Dual FrequencyIEMTELProcess Stability
    Conditioning optimizationHard Mask OpenOxide Nitride SandwichDual FrequencySCCM OxideTELClean / Conditioning
    Arcing indicated by collision rateHard Mask OpenOxide Nitride SandwichDual FrequencySCCM OxideTELMaintenance
    Instable process - different levels in collision rateHard Mask OpenOxide Nitride SandwichDual FrequencySCCM OxideTELFDC
    CD drift due to chamber heating Nitride / OxinitrideDual FrequencySCCM OxideTELProcess Performance
    Increased first wafer effect after PM from chamber heatingStackNitride / OxinitrideDual FrequencySCCM OxideTELMaintenance