• APPLICATION DATABASE
    OTHER

    Processes - Trench

    Title Processes Material Chamber Principle Chamber Hardware Supplier Topic  
    Process out of spec by corroded gas ringTrenchCrystal SiICPTCP®LAMClean / Conditioning
    Wet clean and conditioning checkTrenchCrystal SiMERIEHART TSAMATClean / Conditioning
    E-chuck faultTrenchCrystal SiMERIEHARTAMATFDC
    Implementation of in-situ Measurement Techniques for Plasma ProcessingTrench Dual FrequencyHARTAMATProcess Stability
    Hard mask erosionTrenchCrystal SiMERIE AMATProcess Performance
    Process stability and critical pressure rangeTrench ICPTCP®LAMProcess Performance
    Improved chamber temperature stabilityTrenchOxide Nitride SandwichMERIEHARTAMATClean / Conditioning
    Chamber matchingTrenchCrystal SiMERIEHARTAMATChamber Matching
    De-conditioning by test waferTrenchCrystal SiMERIEHARTAMATClean / Conditioning
    Improve of warm-upTrenchCrystal SiMERIEHARTAMATClean / Conditioning
    E-H-Mode transition and its detection in SF6 plasmaTrenchCrystal SiICPDPSAMATProcess Stability
    Analysis of DT Etch Plasma Problems using a SEERS Plasma SensorTrenchCrystal SiICPDPSAMATFDC