Processes - Trench

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
Process out of spec by corroded gas ring	Trench	Crystal Si	ICP	TCP®	LAM	Clean / Conditioning
Wet clean and conditioning check	Trench	Crystal Si	MERIE	HART TS	AMAT	Clean / Conditioning
E-chuck fault	Trench	Crystal Si	MERIE	HART	AMAT	FDC
Implementation of in-situ Measurement Techniques for Plasma Processing	Trench		Dual Frequency	HART	AMAT	Process Stability
Hard mask erosion	Trench	Crystal Si	MERIE		AMAT	Process Performance
Process stability and critical pressure range	Trench		ICP	TCP®	LAM	Process Performance
Improved chamber temperature stability	Trench	Oxide Nitride Sandwich	MERIE	HART	AMAT	Clean / Conditioning
Chamber matching	Trench	Crystal Si	MERIE	HART	AMAT	Chamber Matching
De-conditioning by test wafer	Trench	Crystal Si	MERIE	HART	AMAT	Clean / Conditioning
Improve of warm-up	Trench	Crystal Si	MERIE	HART	AMAT	Clean / Conditioning
E-H-Mode transition and its detection in SF6 plasma	Trench	Crystal Si	ICP	DPS	AMAT	Process Stability
Analysis of DT Etch Plasma Problems using a SEERS Plasma Sensor	Trench	Crystal Si	ICP	DPS	AMAT	FDC