Processes - Gate etch

Title Processes Material Chamber Principle Chamber Hardware Supplier Topic  
Baratron faultGate etch ICPTCP®LAMFDC
Open area influences the processGate etchPolysilicon / a-SiICPTCP®LAMProcess Stability
Remaining oxide after gate etch correlates with collision rateGate etchOxideICPTCP®LAMProcess Performance
First wafer effect and prediction of etch profile variationsGate etchOxideICPTCP®LAMClean / Conditioning