| Title |
Processes |
Material |
Chamber Principle |
Chamber Hardware |
Supplier |
Topic |
|
| E-chuck fault | Trench | Crystal Si | MERIE | HART | AMAT | FDC |  |
| Implementation of in-situ Measurement Techniques for Plasma Processing | Trench | | Dual Frequency | HART | AMAT | Process Stability |  |
| Improved chamber temperature stability | Trench | Oxide Nitride Sandwich | MERIE | HART | AMAT | Clean / Conditioning |  |
| Chamber matching | Trench | Crystal Si | MERIE | HART | AMAT | Chamber Matching |  |
| De-conditioning by test wafer | Trench | Crystal Si | MERIE | HART | AMAT | Clean / Conditioning |  |
| Improve of warm-up | Trench | Crystal Si | MERIE | HART | AMAT | Clean / Conditioning |  |