Title |
Processes |
Material |
Chamber Principle |
Chamber Hardware |
Supplier |
Topic |
|
E-chuck fault | Trench | Crystal Si | MERIE | HART | AMAT | FDC | ![](/images/lupe.gif) |
Implementation of in-situ Measurement Techniques for Plasma Processing | Trench | | Dual Frequency | HART | AMAT | Process Stability | ![](/images/lupe.gif) |
Improved chamber temperature stability | Trench | Oxide Nitride Sandwich | MERIE | HART | AMAT | Clean / Conditioning | ![](/images/lupe.gif) |
Chamber matching | Trench | Crystal Si | MERIE | HART | AMAT | Chamber Matching | ![](/images/lupe.gif) |
De-conditioning by test wafer | Trench | Crystal Si | MERIE | HART | AMAT | Clean / Conditioning | ![](/images/lupe.gif) |
Improve of warm-up | Trench | Crystal Si | MERIE | HART | AMAT | Clean / Conditioning | ![](/images/lupe.gif) |