Title |
Processes |
Material |
Chamber Principle |
Chamber Hardware |
Supplier |
Topic |
|
Process out of spec by corroded gas ring | Trench | Crystal Si | ICP | TCP® | LAM | Clean / Conditioning | ![](/images/lupe.gif) |
Wet clean and conditioning check | Trench | Crystal Si | MERIE | HART TS | AMAT | Clean / Conditioning | ![](/images/lupe.gif) |
E-chuck fault | Trench | Crystal Si | MERIE | HART | AMAT | FDC | ![](/images/lupe.gif) |
Hard mask erosion | Trench | Crystal Si | MERIE | | AMAT | Process Performance | ![](/images/lupe.gif) |
Chamber matching | Trench | Crystal Si | MERIE | HART | AMAT | Chamber Matching | ![](/images/lupe.gif) |
De-conditioning by test wafer | Trench | Crystal Si | MERIE | HART | AMAT | Clean / Conditioning | ![](/images/lupe.gif) |
Improve of warm-up | Trench | Crystal Si | MERIE | HART | AMAT | Clean / Conditioning | ![](/images/lupe.gif) |
E-H-Mode transition and its detection in SF6 plasma | Trench | Crystal Si | ICP | DPS | AMAT | Process Stability | ![](/images/lupe.gif) |
Analysis of DT Etch Plasma Problems using a SEERS Plasma Sensor | Trench | Crystal Si | ICP | DPS | AMAT | FDC | ![](/images/lupe.gif) |