Material - Crystal Si

Title	Processes	Material	Chamber Principle	Chamber Hardware	Supplier	Topic
Process out of spec by corroded gas ring	Trench	Crystal Si	ICP	TCP®	LAM	Clean / Conditioning
Wet clean and conditioning check	Trench	Crystal Si	MERIE	HART TS	AMAT	Clean / Conditioning
E-chuck fault	Trench	Crystal Si	MERIE	HART	AMAT	FDC
Hard mask erosion	Trench	Crystal Si	MERIE		AMAT	Process Performance
Chamber matching	Trench	Crystal Si	MERIE	HART	AMAT	Chamber Matching
De-conditioning by test wafer	Trench	Crystal Si	MERIE	HART	AMAT	Clean / Conditioning
Improve of warm-up	Trench	Crystal Si	MERIE	HART	AMAT	Clean / Conditioning
E-H-Mode transition and its detection in SF6 plasma	Trench	Crystal Si	ICP	DPS	AMAT	Process Stability
Analysis of DT Etch Plasma Problems using a SEERS Plasma Sensor	Trench	Crystal Si	ICP	DPS	AMAT	FDC
Process Models for Gas Flow Reduction		Crystal Si	RIE		SPTS	Productivity
Fault Classification for Deep Si Etch		Crystal Si	ICP		SPTS	FDC