Title |
Processes |
Material |
Chamber Principle |
Chamber Hardware |
Supplier |
Topic |
|
Conditioning optimization | Hard Mask Open | Oxide Nitride Sandwich | Dual Frequency | SCCM Oxide | TEL | Clean / Conditioning | ![](/images/lupe.gif) |
Arcing indicated by collision rate | Hard Mask Open | Oxide Nitride Sandwich | Dual Frequency | SCCM Oxide | TEL | Maintenance | ![](/images/lupe.gif) |
Instable process - different levels in collision rate | Hard Mask Open | Oxide Nitride Sandwich | Dual Frequency | SCCM Oxide | TEL | FDC | ![](/images/lupe.gif) |
CD drift due to chamber heating | | Nitride / Oxinitride | Dual Frequency | SCCM Oxide | TEL | Process Performance | ![](/images/lupe.gif) |
Increased first wafer effect after PM from chamber heating | Stack | Nitride / Oxinitride | Dual Frequency | SCCM Oxide | TEL | Maintenance | ![](/images/lupe.gif) |