| Title |
Processes |
Material |
Chamber Principle |
Chamber Hardware |
Supplier |
Topic |
|
| Dry clean and process stability improvement | | | ICP | DPS | AMAT | Clean / Conditioning |  |
| E-H-Mode transition and its detection in SF6 plasma | Trench | Crystal Si | ICP | DPS | AMAT | Process Stability | |
| Chamber Matching of ICP Etch Chambers using RF Equipment Model | STI | | ICP | DPS | AMAT | Chamber Matching | |
| Process Stability in Photo Mask Manufacturing | Metal Etch | Metal | ICP | DPS | AMAT | Process Stability | |
| Analysis of DT Etch Plasma Problems using a SEERS Plasma Sensor | Trench | Crystal Si | ICP | DPS | AMAT | FDC | |
| ICC Development and Characterization | | | ICP | DPS | AMAT | Clean / Conditioning | |
| Implementation of a robust virtual metrology for plasma etching | Gate etch | Oxide | ICP | DPS | AMAT | Virtual Metrology | |
Company
Events