Courses:

• Plasma School for Semiconductor Manufacturing

  • Module: Plasma Physics Fundamentals

  • Module: Process Fundamentals
    

  • Module: Equipment

  • Plasma Etch Tools

  • Plasma Deposition Tools
    

    Sputtering
    

• Radio Frequency Technology for Plasma Applications

• RTP Course: “Theory and Practice“ operated by HQ-Dielectrics
  

Adcanced Courses:

• Electrostatic chuck ESC
  
• Arcing and Charging
  
• Conditioning and Chamber Matching
• Plasma Nitridation of Ultra Thin SiO₂ Films
• Deep Reactive Ion Etching (Main focus: Bosch process)
  

Special Courses (chamber related):

• Applied Materials^® DPN
  
• Applied Materials^® DPS
  
• Lam^® (Novellus) SPEED^®
• Lam^® (Novellus) Sequel^®

The Plasmetrex Plasma Service Concept

Service and Consulting offered by Plasmetrex

Audience: 

• Process, maintenance, or equipment engineers (plasma etching, PECVD, sputtering)

Target: 

• Basic knowledge of plasma processing and RF technology for every day usage in semiconductor manufacturing

Two Course Lectures:

• Quality, knowlegde, and experience of lectures is at least as important as the quality of the training manual.

Features:

•  Comprehensive training manual

• Certificate

• Short final test 

• Course evaluation

Movies and simulations:

• Space charge sheath (dark space): Formation and structures

• Effect of parameter variation in plasmas:

  • RF power
  • pressure

• Collisionless heating of electron in low-pressure processing

• Phase angle of bias and source power
  

• Particle transport and removal

Experiments:

• Plasma and magnetic field (video alternatively)

• Live plasma experiment shows interaction with a static
  magnetic field by rotation of the plasma (Faraday effect).

    Same principle as used in MERIE chambers as

     TEL™ DRM

     Applied Materials^® - MxP family.