First Wafer Effect

FDC

Pre-process Issuses

Chamber Matching

Process Development


Hercules® Products

Hercules PMX

Hercules C
Hercules N500

Hercules® HiRes PMX

Hercules® HiRes C

Hercules® HiRes compact

comming soon


Sensor heads for different etch and deposition tools
Data analyse with HercViewer or HercLotViewer
Data Coupling
with FAB host
Data Management by Hercules® Master


Sensor installation and base lining at least one wet clean cycle


Use our online process platFlat Panel

Manufacturingform:
APPLICATION GUIDE,
CONDITIONING GUIDE, CHAMBER MATCHING GUIDE


Easy decision making, fast response to process faults,
saving tool up-time, test wafers, and spare parts


In case of tricky issues please use
the Plasmetrex process services around all plasma problems
including training of your employees.


Hercules® Products


Classical Manufacturing

Options

Photovoltaic, MEMS

Etch

PECVD / HDP

(low pressure)1

Hercules® HiRes C

Additional plasma parameters SheathHeating and Asymmetry of the plasma

  • E- H-mode detection for ICPs
  • arcing detection

Bias-Power extension for Hercules® HiRes series

  • layer and DRIE quality control for Etch or CVD, 
    using model-based LF current extraction,
  • automatic frequency measurement of LF
Hercules® HiRes compact

PECVD
(high pressure)2

Hercules® HiRes N

Bias-Power extension for Hercules® HiRes series

  • layer and DRIE quality control for Etch or CVD, 
    using model-based LF current extraction,
  • automatic frequency measurement of LF
Hercules® HiRes compact

R & D
Etch and deposition

Hercules® HiRes PMX

Additional analog inputs for endpoit signal, tool parameters ...

Additional plasma parameters SheathHeating and Asymmetry of the plasma

  • E- H-mode detection for ICPs
  • arcing detection

Bias-Power extension for Hercules® HiRes series

  • layer and DRIE quality control for Etch or CVD, 
    using model-based LF current extraction,
  • automatic frequency measurement of LF


1 up to 35 Pa (250 mTorr)
2 60 Pa - 1 kPa (430 mTorr - 7.5 Torr)

Subject to technical alternations!