• PRODUCT GUIDE
    PLASMA PROCESS CONTROL
    EXPERIENCE & TRAINING
    RF TECHNOLOGY and PROCESS SERVICES
    REFERENCES
    OTHER

    First Wafer Effect

    FDC

    Pre-process Issuses

    Chamber Matching

    Process Development


    Hercules® Products



    Hercules® C SmartM



    Sensor heads for different etch and deposition tools
    Data analyse with HercViewer or HercLotViewer
    Data Coupling     with FAB host
    Data Management by Hercules® Master

    Sensor installation and base lining at least one wet clean cycle


    Use our online process platFlat Panel

    Manufacturingform:
    APPLICATION GUIDE,     CONDITIONING GUIDE, CHAMBER MATCHING GUIDE

    Easy decision making, fast response to process faults,
    saving tool up-time, test wafers, and spare parts


    In case of tricky issues please use
    the Plasmetrex process services around all plasma problems
    including training of your employees.


    Hercules® Products

    Classical Manufacturing

    Options

    Etch

    PECVD / HDP

    (low pressure)1

    Hercules® C SmartM

    Additional plasma parameters SheathHeating and Asymmetry of the plasma

    • E- H-mode detection for ICPs
    • arcing detection

    Bias-Power extension for Hercules® HiRes series

    • layer and DRIE quality control for Etch or CVD, 
      using model-based LF current extraction,
    • automatic frequency measurement of LF

    PECVD
    (high pressure)2

    Hercules® N SmartM

    Bias-Power extension for Hercules® HiRes series

    • layer and DRIE quality control for Etch or CVD, 
      using model-based LF current extraction,
    • automatic frequency measurement of LF

    1 up to 35 Pa (250 mTorr)
    2 60 Pa - 1 kPa (430 mTorr - 7.5 Torr)

    Subject to technical alternations!