Chamber Matching of ICP etch chambers using RF
equipment model
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- Simple approach: Measurement at operating frequency:
- Fast and easy → first results immediately available
- Limited accuracy, some parameters are not measurable this
way.
- Advanced approach: Impedance spectroscopy:
- Characterization of RF components by using broad a
frequency range
- Advantage of outstanding accuracy.
- Impedance spectroscopy enables the usage of RF equipment
models.
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![Setup for RF peak voltage measurement](/images/consulting/Wagner-1-450.png) |
After corrective actions
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- After the corrective actions have been implemented, the STI
etch rates harmonized significantly. This effect is clearly visible in
the endpoint charts and process etch time charts.
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![Equivalent Ciruit of Plasma Tool](/images/consulting/Wagner-2-450.png) |
R. Wagner, M. Klick, Chamber Matching of ICP etch
chambers using RF equipment model
12th European Advanced
Proccess Control and Manufacturing
Conference, Minatec, Grenoble, France, April 16-18, 2012
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