Problem | Solutions |
RF issues | - Alternative RF generator synchronization
- Extension of matchbox range
- Peak voltage measurement
|
ESC (bipolar, anodized and bonded ceramics) - Clamping force reduction due to aging
(increased He leak flow) - Wafer damaging
- Wafer sticking
| - Mature model of bipolar ESCs characterization and aging state
- Real time with additional measurement hardware - FDC
- Off-line characterization – aging state
- Refurbishment with competence partners
|
ICP source characterization for uniformity improvement and chamber matching | - Assessment of the coil design
- RF component model - RF losses
- Creation of an RF equipment model
- Magnetic field strength mapping magnetic flux at operating frequency
|
RF chamber matching | - Chamber component description via RF equipment model
- Electrode system incl. ESC
- Source
|
Experience at |
|
Applied Materials | - DPS Poly
- DPS DT
- DPS metal
- MxP, eMxP+, Super e, ...
- PreClean II
- IMP
- TxZ
|
Lam incl Novelus | - Exelan
- TCP9400 SE/PTX/DFM
- TCP9600 SE/PTX
- 442X, 4520
- Sequel
- SPEED
|
Trkon / Aviza / SPTS | - CSE, HSE
- Omega 201
- Delta 201
|