TOOL AND PROCESS REFERENCES

Supplier Tool Process

Applied   

Materials®

Mark II™ , MxP™ , MxP+™ , eMxP+™ , Super e™ , eMax™

DPS™ , DPS+™ , DPS II

HART™ , HART TS(+) 200 mm, 300 mm

Ultima 200 mm

oxide, contact hole, via hole, gate contact mask open, trench

gate contact (poly), recess (Si)

deep trench

dielectric deposition

Lam® form. Novellus®

Speed 200mm, 300 mm, Producer 300 mm,

Sequel 200 mm

dielectric deposition

dielectric deposition

Trikon®

AVIZA®

SPTS®

Aviza CSE/HSE

Omega 201

Dellta 201

sputter etch

etch

SiN deposition 

Lam®   

Research®

TCP® 9400 SE, TCP® 9400 PTX

TCP® 9600 SE, TCP® 9600 PTX (Al)  

2300 Versys® incl. Kiyo™ Star Kiyo™ 45,

200 mm & 300 mn

gate contact (poly), trenching, STI, nitride

Al etch

gate contact (poly), metal (Al), carbon


TEL®

IEM™ Oxide

SCCM™ poly 200 mm

SCCM™ oxide 300 mm

Vesta™

Vigus

RLSA

dielectric etch

poly etch

dielectric etch


dielectric etch


Oxford   

Instruments®

ICP III/V etch

PlasmaTherm®

now Unaxis®

PlasmaTherm 790

Mask Etcher® Series Gen V

III/V etch

mask etch

Sentech®

SI 500etch, i.e. Bosch DRIE