• PRODUCT GUIDE
    PLASMA PROCESS CONTROL
    EXPERIENCE & TRAINING
    RF TECHNOLOGY and PROCESS SERVICES
    REFERENCES
    OTHER

    TOOL AND PROCESS REFERENCES

    Supplier Tool Process

    Applied   

    Materials®

    Mark II™ , MxP™ , MxP+™ , eMxP+™ , Super e™ , eMax™

    DPS™ , DPS+™ , DPS II

    HART™ , HART TS(+) 200 mm, 300 mm

    Ultima 200 mm

    oxide, contact hole, via hole, gate contact mask open, trench

    gate contact (poly), recess (Si)

    deep trench

    dielectric deposition

    Lam® form. Novellus®

    Speed 200mm, 300 mm, Producer 300 mm,

    Sequel 200 mm

    dielectric deposition

    dielectric deposition

    Trikon®

    AVIZA®

    SPTS®

    Aviza CSE/HSE

    Omega™ 201

    Dellta™ 201

    sputter etch

    etch

    SiN deposition 

    Lam®   

    Research®

    TCP® 9400 SE, TCP® 9400 PTX

    TCP® 9600 SE, TCP® 9600 PTX (Al)  

    2300 Versys® incl. Kiyo™ Star Kiyo™ 45,

    200 mm & 300 mn

    gate contact (poly), trenching, STI, nitride

    Al etch

    gate contact (poly), metal (Al), carbon
    TEL®

    IEM™ Oxide

    SCCM™ poly 200 mm

    SCCM™ oxide 300 mm

    Vesta™

    Vigus™

    RLSA™

    dielectric etch

    poly etch

    dielectric etch


    dielectric etch

    Oxford   

    Instruments®

    		 ICP III/V etch

    PlasmaTherm®

    now Unaxis®

    PlasmaTherm 790

    Mask Etcher® Series Gen V

    III/V etch

    mask etch

    Sentech®

    		SI 500etch, i.e. Bosch DRIE