First Wafer Effect

FDC

Pre-process Issuses

Chamber Matching

Process Development


Hercules® Products

Hercules PMX

Hercules C
Hercules N500

Hercules® HiRes PMX 

Hercules® HiRes C

Hercules® HiRes compact

coming soon


Sensor heads for different etch and deposition tools
Data analyse with HercViewer or HercLotViewer
Data Coupling
with FAB host
Data Management by Hercules® Master


Sensor installation and base lining at least one wet clean cycle



Easy decision making, fast response to process faults,
saving tool up-time, test wafers, and spare parts


In case of tricky issues please use
the Plasmetrex process services around all plasma problems
including plasma training of your employees.


Hercules® Products

Base systems


Extensions


Photovoltaic

Etch
(low pressure)1

Hercules® HiRes C

  1. High-sensitivity plasma parameters SheathHeating and Asymmetry
  2. Bias power extension for layer quality control for Etch or CVD, using model-based LF 

 Hercules® HiRes C compact

PECVD / HDP
(low pressure)1

Hercules® HiRes C

  1. High-sensitivity plasma parameters SheathHeating and Asymmetry
  2. Bias power extension for layer quality control for Etch or CVD, using model-based LF 

Hercules® HiRes C compact

PECVD
(high pressure)2

Hercules® HiRes N

  1. Bias power extension for layer quality control for Etch or CVD, using model-based LF 

Hercules® HiRes N compact

R & D
Etch and deposition

Hercules® HiRes PMX




1 up to 35 Pa (250 mTorr)
2 60 Pa - 1 kPa (430 mTorr - 7.5 Torr)

Subject to technical alternations!