Altered chemical properties of media and
Altered chemical properties of media and materials directly affect the process. Plasma parameters, particularly the electron collision rate, are very sensitive to these changes.
Depending on the media supply system, media faults affect multiple tools. Faults may be caused by gas, water, targets, photo resists, and developer.
|Production environment||Cleanroom conditions such as temperature, particle density, cooling water (for matchbox efficiency), and compressed air can also contribute to process faults.|