ALL CHAMBERS: MEDIA FAULT

REASON	DESCRIPTION
Altered chemical properties of media and materials	Altered chemical properties of media and materials directly affect the process. Plasma parameters, particularly the electron collision rate, are very sensitive to these changes. Depending on the media supply system, media faults affect multiple tools. Faults may be caused by gas, water, targets, photo resists, and developer. Reasons are Aging Variations between the charges Change in supplier Exchange of storage and delivery container
Production environment	Cleanroom conditions such as temperature, particle density, cooling water (for matchbox efficiency), and compressed air can also contribute to process faults.

REASON

DESCRIPTION

Altered chemical properties of media and materials

Altered chemical properties of media and materials directly affect the process. Plasma parameters, particularly the electron collision rate, are very sensitive to these changes.

Depending on the media supply system, media faults affect multiple tools. Faults may be caused by gas, water, targets, photo resists, and developer.

Reasons are

Aging
Variations between the charges
Change in supplier
Exchange of storage and delivery container

Production environment

Cleanroom conditions such as temperature, particle density, cooling water (for matchbox efficiency), and compressed air can also contribute to process faults.