APPLICATION GUIDE APPLICATION DATA BASE SENSOR CATALOG DOWNLOAD
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PRODUCT GUIDE
Hercules® at a Glance
Semiconductor Plasma Process Sensor
Consulting Overview
Total Process Control Solution
PLASMA PROCESS CONTROL
Plasma Control Concept
Plasma Metrology
Data Handling
EXPERIENCE & TRAINING
Training Concept
Plasma School
RF TECHNOLOGY and PROCESS SERVICES
RF Chamber Matching
Spare Part Management
Uniformity Improvement
Large Area Uniformity Simulation
REFERENCES
Tool and Process
Hercules® Customers
Experience & Training
Partners
FAQs
Impressum
Company
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TOOL AND PROCESS REFERENCES

Supplier Tool Process
Applied Materials® Mark II™ , MxP™ , MxP+™ , eMxP+™ , Super e™ , eMax™ oxide, contact hole, via hole, gate contact mask open, trench
  DPS™ , DPS+™ , DPS II gate contact (poly), recess (Si)
  HART™ , HART TS(+) 200 mm, 300 mm
deep trench
  Ultima 200 mm insulator deposition
Novellus Speed 200mm, 300 mm insulator deposition
Trikon Omega  
Lam Research® TCP® 9400 SE, TCP® 9400 PTX gate contact (poly), trenching, STI, nitride
  TCP® 9600 SE, TCP® 9600 PTX (Al)  
  2300 Versys® incl. Kiyo™, 200 mm, 300 mm gate contact (poly), metal (Al), carbon
TEL TEL IEM™ Oxide  
  TEL SCCM™ poly 200 mm  
  TEL SCCM™ oxide 300 mm  
Oxford Instruments ICP etch
PlasmaTherm (now Unaxis) CCP etch