PRODUCT GUIDE

Hercules^® at a Glance

Semiconductor Plasma Process Sensor

Photovoltaics Plasma Process Sensor

Total Process Control Solution

PLASMA PROCESS CONTROL

Plasma Control Concept

Plasma Metrology

Data Handling

EXPERIENCE & TRAINING

Training Concept

Plasma School

RF TECHNOLOGY and PROCESS SERVICES

RF Chamber Matching

Uniformity Improvement

Large Area Uniformity Simulation

REFERENCES

Tool and Process

Hercules^® Customers

Experience & Training

Partners

FAQs

2010 © Plasmetrex GmbH

PLASMA SCHOOL FOR SEMICONDUTOR MANUFACTURING

This course provides knowledge on plasma principles and capability of semiconductor manufacturing technologies.

Location: Courses at the Customer Site

The course includes:

MODULE: PLASMA PHYSICS FUNDAMENTALS
	Elementary plasma physics DC discharge RF discharge CCP - Capacitively Coupled Plasma ICP / TCP^® - Inductively Coupled Plasma Electron Cyclotron Resonance NLD - Neutral Loop Discharge Remote and pulsed plasmas RF power in plasma Plasma process control in Fab Methods of plasma diagnostics
MODULE: EQUIPMENT
	Plasma Etch Tools The plasma process, reactor types Capacitively Coupled Plasma MERIE reactors Dual frequency reactors Inductively Coupled Plasma ( ICP / TCP^®) Comparison of chamber types Etch chemistry

	Plasma Deposition Tools Sputtering cleaning Sputter deposition Plasma Enhanced Vapor Deposition Nitridation (summary)
MODULE: PROCESS FUNDAMENTALS
	Basics of plasma processing Physical etching (Sputtering) Etching: Chemistry, selectivity, and profiles Limitations of plasma processes Deposition Chamber design Preprocess faults Cost control by quality and process management
MODULE: PROCESS and EQUIPMENT INTERACTION
	Conditioning and Chamber Matching Motivation Gas heating Memory effects at chamber wall Conditioning Chamber matching

	Wafer Damaging, E-Chuck, and Arcing Wafer Charging and Arcing The ElectroStatic Chuck Thermal Conductivity in Thin Gases ESC and Etch Process Chamber Arcing and Particles Specific Problems of Dielectric Wafers

	Plasma Nitridation of ultra thin SIO₂ Films RF Plasma Remote Plasma and pulsed RF Plasma Nitridation