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WORKSHOP ON SELF EXCITED ELECTRON PLASMA RESONANCE SPECTROSCOPY (SEERS)

 

2007 - 2004 - 2000 - 1999

2007

4th Workshop on Self Excited Electron Plasma Resonance Spectroscopy (SEERS),
(User Group Meeting at 8th European AEC/APC Conference), 2007, Dresden, Germany

Plasmetrex Strategy and Roadmap
M. Klick – Plasmetrex GmbH

Hercules® - Tool for Technology Improvement and Fault Detection @ Micron`s Etch Chambers
R. Benson, et.al. – Micron Technology, Inc.

Hercules® inside commercial FDC System Maestria
D. Föh – Micronas GmbH

Simulation of the SEERS Diagnostic Method - New Analysis ans new Results
R.-P. Brinkmann – Ruhr-University Bochum

2004

3rd Workshop on Self Excited Electron Plasma Resonance Spectroscopy (SEERS),
(User Group Meeting at 5th European AEC/APC Conference), 2004, Dresden, Germany

SEEERS under Industrial Conditions
M. Klick – ASI Advanced Semiconductor Instruments GmbH

Modelling and Simulation of SEERS
R.P. Brinkmann, Th. Mussenbrock – Ruhr - University Bochum

Diagnostics of plasma-particle interaction by SEERS and other methods
H. Kersten – INP Greifswald

Process stability by SEERS at Micronas
D. Föh – Micronas

HERCULES® APC xM - SEERS Implementation for the New Tool Generation
M. Klick – ASI Advanced Semiconductor Instruments GmbH

2000

2nd Workshop on Self Excited Electron Plasma Resonance Spectroscopy, Dresden, December 11–12, 2000, Germany

Basic of SEERS Implementation at Hercules® Measurement System
M. Klick – ASI GmbH

Simultaneous Measurement of Electron Density and Electron Temperature in Highly Reactive Capacitively Coupled Plasma
G. Franz – Infineon Technologies München, et al.

Use of Data Mining Techniques for Model Based Data Analysis of Plasma Parameters, Electrical Data and Yield in High Volume DRAM Production
U. Nehring – Infineon Technologies Dresden

New Simulations about SEERS
P. Brinkmann – University Bochum, et al.

SEERS Diagnostics at Plasmas used in Powder Processing
H. Kersten – University Greifswald, et al.

Measurement of Electron Collision Rate and Electron Density at Pulsed R.F.-Plasma
R.-D. Schulze – BAM, et al.

Application Examples of SEERS at DRAM Production
on 300 mm Wafers

V. Tegeder - Infineon Technologies Dresden, et al.

Overview of SEERS Application at AMD
Müller – AMD Dresden

Application of Plasma Parameters to Advanced Process Control
A. Steinbach – Infineon Technologies Dresden

Characterization of a Plasma with SEERS by an Aaluminium-Etch
M. Schardin – Infineon Technologies Dresden, et al.

Recent Status of SEERS Application at Infineon Regensburg
K. Reingruber – Infineon Technologies Regensburg

Arcing Prevention by Dry Clean Optimization using Plasma Parameter Monitoring
M. Hartenberger – BTU Cottbus, et al.

Tool Comparison at GC Stack Etch in LAM® TCP® using Plasma Parameters (SEERS)
C. Steuer – TU Dresden

Application of Plasma Parameters to characterize Product Interactions between Memory and Logic Products at Gate Contact (GC) Stack Etch in LAM ® TCP ®
T. Dittkrist – TU Dresden

Comparison of APPLIED MATERIALS DPS™ Chambers used for Poly - Si Etch Processes by Plasma Parameters
Christoph – Infineon Technologies Dresden

Investigations on two different Plasma Tools by SEERS, OES and Electrical Measurements
J.-K. Bauer – TU Dresden

Concepts of Plasma Data Analysis and Equipment Coupling
D. Suchland – ASI GmbH

Development Roadmap of SEERS Implementations
M. Klick - ASI GmbH

1999

1st Workshop on Self Excited Electron Plasma Resonance Spectroscopy, Dresden, Juni 8–9, 1999, Germany 

Simulation of Plasma Processes for Mikroelectronics Fabrication 
R. P. Brinkmann – Infineon Technologies München, et al. 

Investigation of Cl2 / BCl3 - Plasmas with SEERS and Optical Spectroscopy 
G. Franz –Infineon Technologies München, et al. 

Investigation of SF6 Plasma at ICP Chamber of the STS ASE Tool with SEERS 
T. Haase – Fraunhofer IMS Dresden 

Process and Tool Monitoring at Metal Etch in LAM®TCP®
P. Höhmann – Infineon Technologies Regensburg, et al. 

On the Plasma Modification of Micro-disperse Powder Particles
H. Kersten – University Greifswald, et al. 

Application of the Plasma Monitoring System HERCULES ® on Process Monitoring of Oxide Etch at APPLIED MATERIALS ® MxP+™ Chamber 
A. Steinbach – Infineon Technologies Dresden, et al. 

Business and technical Roadmap of HERCULES®
M. Klick – ASI GmbH 

Application of HERCULES® for Engineering and Maintenance
A. Steinbach – Infineon Technologies Dresden, et al. 

Setup and Integration of the Plasma Monitoring System HERCULES® PL at 300 mm APPLIED MATERIALS® Centura and first Results 
V. Tegeder – Semiconductor 300 Dresden