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Supplier - AMAT

Title Processes Material Chamber Principle Chamber Hardware Supplier Topic  
Arcing in gas distribution  MERIEMxPAMATMaintenance
Gas composition and process results OxideMERIEMxP+AMATProcess Performance
Etch rate dependence on plasma parametersVIA etchNitride / OxinitrideMERIEMxP+AMATProcess Performance
Contact angle (slope of side wall) depending on plasma parameters  MERIEMxP+AMATProcess Performance
Magnetic field failure  MERIEMxPAMATMaintenance
Instable chamber pressure OxideMERIE AMATFDC
Wet clean and conditioning checkTrenchCrystal SiMERIEHART TSAMATClean / Conditioning
E-chuck faultTrenchCrystal SiMERIEHARTAMATFDC
Endpoint verification OxideMERIEMxP+AMATProcess Performance
Implementation of in-situ Measurement Techniques for Plasma ProcessingTrench Dual FrequencyHARTAMATProcess Stability
Particle in a CVD processCVDOxideHDP-CVDUltimaAMATFDC
Hard mask erosionTrenchCrystal SiMERIE AMATProcess Performance
Instable process start with magnetic field  MERIE AMATProcess Performance
Parasitic plasma in He feedthroughVIA etchOxideMERIEMxP+AMATFDC
Open area shifts plasma parametersVIA etchOxideMERIEMxP+AMATProcess Performance
Etch rate depends on matchbox  MERIEMxP+AMATMaintenance
B-field real time supervision  MERIE AMATDevelopment
Magnetic field and process stability  MERIE AMATDevelopment
Optimization of wet clean cycle OxideMERIEMxP+AMATProductivity
Influence of shadow ring material Nitride / OxinitrideMERIEMxPAMATClean / Conditioning
Dry clean and process stability improvement  ICPDPSAMATClean / Conditioning
Insensitive etch rate on test wafersVIA etch MERIEMxP+AMATProcess Performance
Tool and chamber long term matching OxideRIEMxP+AMATChamber Matching
Improved chamber temperature stabilityTrenchOxide Nitride SandwichMERIEHARTAMATClean / Conditioning
De-conditioning by test waferTrenchCrystal SiMERIEHARTAMATClean / Conditioning
Chamber matchingTrenchCrystal SiMERIEHARTAMATChamber Matching
Quality Management in large Area PECVD CVDPolysilicon / a-SiPE-CVDAKTAMATProcess Performance
Improve of warm-upTrenchCrystal SiMERIEHARTAMATClean / Conditioning
Uniformity and Process transferCVDPolysilicon / a-SiPE-CVDAKTAMATDevelopment
PECVD Process Monitoring In Thin Film Silicon Solar Cell ManufacturingCVDPolysilicon / a-SiPE-CVDAKTAMATProcess Stability
E-H-Mode transition and its detection in SF6 plasmaTrenchCrystal SiICPDPSAMATProcess Stability
Chamber Matching of ICP Etch Chambers using RF Equipment ModelSTI ICPDPSAMATChamber Matching
Process Stability in Photo Mask ManufacturingMetal EtchMetalICPDPSAMATProcess Stability
Analysis of DT Etch Plasma Problems using a SEERS Plasma SensorTrenchCrystal SiICPDPSAMATFDC
ICC Development and Characterization  ICPDPSAMATClean / Conditioning